Universal Remote Control R7 - SPECS SHEET Bedienungsanleitung Seite 5

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Data Sheet ADP5585
Rev. C | Page 5 of 40
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VDD to GND 0.3 V to +4 V
SCL, SDA,
RST
,
INT
, R0, R1, R2, R3, R4,
C0, C1, C2, C3, C4 to GND
0.3 V to (VDD + 0.3 V)
Temperature Range
Operating (Ambient) 40°C to +85°C
1
Operating (Junction) 40°C to +125°C
Storage 65°C to +150°C
1
In applications where high power dissipation and poor thermal resistance
are present, the maximum ambient temperature may need to be derated.
Maximum ambient temperature (T
A (MAX)
) is dependent on the maximum
operating junction temperature (T
J (MAXOP)
= 125°C), the maximum power
dissipation of the device (P
D (MAX)
), and the junction-to-ambient thermal
resistance of the device/package in the application (θ
JA
), using the following
equation: T
A (MAX)
= T
J (MAXOP)
JA
× P
D (MAX)
).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a printed circuit board (PCB) for surface-mount
packages.
Table 3.
Thermal Resistance θ
JA
Unit
16-Ball WLCSP 62 °C/W
Maximum Power Dissipation 70 mW
16-Lead LFCSP
67.154
°C/W
Maximum Power Dissipation 70 mW
ESD CAUTION
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